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APIC YAMADA KK

Overview
  • Total Patents
    273
About

APIC YAMADA KK has a total of 273 patent applications. Its first patent ever was published in 1991. It filed its patents most often in Japan, Republic of Korea and Taiwan. Its main competitors in its focus markets machines, semiconductors and machine tools are OSADA MICHIO, FUIISA KK and JOHN WOOD.

Patent filings in countries

World map showing APIC YAMADA KKs patent filings in countries
# Country Total Patents
#1 Japan 267
#2 Republic of Korea 3
#3 Taiwan 3

Patent filings per year

Chart showing APIC YAMADA KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Miyajima Fumio 51
#2 Yamaguchi Tatsuyoshi 30
#3 Kobayashi Kazuhiko 26
#4 Ando Makoto 23
#5 Todoroki Yoshihisa 16
#6 Yanagisawa Akira 11
#7 Takizawa Makoto 9
#8 Morimura Masahiro 8
#9 Ikeda Masanobu 8
#10 Harayama Minoru 8

Latest patents

Publication Filing date Title
JPH1177734A Resin molding method and resin molding device
JPH10156898A Resin molding machine
JPH1177755A Molding tool for injection molding
JPH1187376A Resin supplying apparatus and resin sealing apparatus having the same
JPH1177733A Resin molding method and resin molding device
JPH1157886A Press processing die of type for ristricting pitch change due to elevated temperature
JPH1157879A Press processing die of horizontal stripper pressurizing machine
JPH1158435A Resin mold apparatus
JPH1167801A Metal mold for substrate
TW410194B Resin molding machine
JPH1134066A Resin mold device using release film and resin molding method
JPH1092856A Method for resin-sealing chip size package and resin-sealing device
JPH1140579A Carrying equipment for semiconductor device manufacture
JPH1140582A Press carriage equipment for semiconductor manufacture
JPH1119740A Motor-driven press device
JPH1119731A Press forming die with stripper pressure reducing mechanism
JPH1110654A Resin sealing apparatus
JPH1116932A Molding die with movable cavity
JPH10328752A Punching die having ejector
JPH10323797A Motor press machine