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JPH098073A
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Metal mold equipment for manufacturing semiconductor device suitable for small amount production of many kinds of products
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JPH09115938A
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Multi-plunger-type resin mold for sealing semiconductor suited for manufacture of many kinds in small quantity
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JPH0645379A
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Resin-sealing and molding method for semiconductor element
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JPH0388092A
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Radio wave transmitting/receiving system for toll road, vehicle separation system and information processing method
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US4862586A
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Lead frame for enclosing semiconductor chips with resin
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JPS6453556A
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Resin molding method of semiconductor device
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JPS6458617A
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Method and apparatus for continuous and automatic formation of resin sealed package
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JPS6444026A
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Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
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JPS6410633A
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Method and metal mold apparatus for formation of plastic seal of semiconductor element and lead frame therefor
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JPS63319116A
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Method for mounting resin mold and mold fixing device
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JPS63273325A
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Method and apparatus for resin-sealing semiconductor element
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US4793785A
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Apparatus of multiplunger type for enclosing semiconductor elements with resin
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JPS63246218A
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Continuous automatic resin sealing method
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JPS63188737A
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Wear testing method for surface of plastic molding metallic mold
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JPS62269331A
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Manufacture of semiconductor device fit for multple-product small-quantity production
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JPS62269330A
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Cavity block fixing structure for resin mold die for semiconductor element
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JPS62269329A
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Ejector plate mount structure for semiconductor element resin mold die
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JPS62269328A
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Multi-plunger resin mold unit for sealing semiconductor device fit for multiple-product small-quantity production
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JPS62269327A
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Manufacture of semiconductor device fit for multple-product small-quantity production
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US4723899A
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Molding apparatus for enclosing semiconductor chips with resin
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