Learn more

CLUSTER TECH CO LTD

Overview
  • Total Patents
    13
  • GoodIP Patent Rank
    135,054
  • Filing trend
    ⇩ 100.0%
About

CLUSTER TECH CO LTD has a total of 13 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2014. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets macromolecular chemistry and polymers, semiconductors and surface technology and coating are HUNAN GUOXIN SEMICONDUCTOR TECH CO LTD, NAMICS CORP and HENKEL LOCTITE CORP.

Patent filings in countries

World map showing CLUSTER TECH CO LTDs patent filings in countries

Patent filings per year

Chart showing CLUSTER TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yoshida Tsukasa 7
#2 Oishi Satoshi 7
#3 Sato Atsushi 7
#4 Suzuki Hirose 7
#5 Adachi Yoshinori 7
#6 Adachi Yoshiaki 6
#7 Adachi Toshihiko 3
#8 Okuda Jyunko 1
#9 Tosaka Masakazu 1
#10 Kodera Fuji 1

Latest patents

Publication Filing date Title
WO2017131152A1 Curable epoxy resin composition for white reflectors, cured product thereof, substrate for mounting optical semiconductor element, and optical semiconductor device
JP2018015712A Dispenser nozzle and fluid dispensation device using the same
JP2017190372A Resin composition for integral molding with metal substrate, composite molded body and manufacturing method therefor
JP2017188621A Semiconductor element mounting package, manufacturing method thereof, and substrate plate for manufacturing the package
JP2019065058A Curable epoxy resin composition for white reflector and cured product thereof, substrate for mounting optical semiconductor element, optical semiconductor device and production methods thereof
JP2017137408A Curable epoxy resin composition for white reflector and cured article thereof, substrate for mounting optical semiconductor element and optical semiconductor device
CN107207704A White reflector shaping curable epoxy resin composition and its solidfied material, optical semiconductor board for mounting electronic and optical semiconductor device
JP2016076669A Semiconductor element mounting package and method of manufacturing the same, and substrate plate for manufacturing package