| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Austria | 3 | |
| #2 | EPO (European Patent Office) | 2 | |
| #3 | Taiwan | 2 | |
| #4 | WIPO (World Intellectual Property Organization) | 2 | |
| #5 | Canada | 1 | |
| #6 | China | 1 | |
| #7 | Hong Kong | 1 | |
| #8 | Malaysia | 1 | |
| #9 | Singapore | 1 | |
| #10 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Audio-visual technology | |
| #3 | Electrical machinery and energy | |
| #4 | Semiconductors | |
| #5 | Materials and metallurgy | |
| #6 | Machines | |
| #7 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Haegele Bernd | 11 |
| #2 | Tusler Wolfgang | 6 |
| #3 | Burns Robert Christopher | 6 |
| #4 | Bernd Haegele | 1 |
| Publication | Filing date | Title |
|---|---|---|
| AT512041A4 | Method for producing a metallized substrate | |
| AT512525B1 | Printed circuit board, in particular for a power electronics module, comprising an electrically conductive substrate | |
| EP2025209A2 | Method for manufacturing a circuit carrier | |
| AT503706A1 | Circuit carrier |