ELMICRON AG has a total of 16 patent applications. Its first patent ever was published in 2000. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and Australia. Its main competitors in its focus markets audio-visual technology, semiconductors and machine tools are MULTI KK, NIPPON CMK KK and NAGANUMA NOBUYUKI.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 6 | |
#2 | EPO (European Patent Office) | 4 | |
#3 | Australia | 3 | |
#4 | China | 1 | |
#5 | Taiwan | 1 | |
#6 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Semiconductors | |
#3 | Machine tools | |
#4 | Computer technology | |
#5 | Machines | |
#6 | Surface technology and coating | |
#7 | Materials and metallurgy |
# | Name | Total Patents |
---|---|---|
#1 | Steiert Philippe | 14 |
#2 | Schmidt Walter | 8 |
#3 | Walz Silke | 7 |
#4 | Staufert Gerhard | 3 |
#5 | Galster Norbert | 2 |
#6 | Palm Gerhard | 2 |
#7 | Uggowitzer Peter J | 2 |
#8 | Egger Ignaz | 2 |
#9 | Dommann Alex | 2 |
#10 | Schmidt W | 1 |
Publication | Filing date | Title |
---|---|---|
EP1507448A1 | Base material, substrate and connection module | |
AU2003201247A1 | Embossing die for fabricating high density interconnects and method for its fabrication | |
AU2002342490A1 | Method for fastening microtool components to objects | |
TW546717B | A method, installation and device for manufacturing an electrical connecting element as well as an electrical connecting element and a semi-finished product | |
WO02092326A1 | Extrusion die | |
WO02093258A1 | Method for producing stamping tools | |
WO02054840A1 | Method for producing electroconductive structures | |
CN1408197A | Method, facility and device for producing electrical connecting element, product and semi-finished products thereof | |
US6788546B1 | Multi-chip module |