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MICROFAB TECH INC

Overview
  • Total Patents
    42
About

MICROFAB TECH INC has a total of 42 patent applications. Its first patent ever was published in 1987. It filed its patents most often in United States, Australia and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets machines, machine tools and textiles and paper are SHINKO ELECTRIC INDUSTRY CO LTD, SHINKO SEIKI COMPANY LTD and RJR POLYMERS INC.

Patent filings in countries

World map showing MICROFAB TECH INCs patent filings in countries

Patent filings per year

Chart showing MICROFAB TECH INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hayes Donald J 33
#2 Wallace David B 15
#3 Frederickson Christopher J 7
#4 Taylor David W 7
#5 Cox W Royall 4
#6 Boldman Michael T 3
#7 Achiriloaie Ioan 2
#8 Hayes Matthew D 2
#9 Self Roger G 1
#10 Sinks Murray 1

Latest patents

Publication Filing date Title
US7152984B1 Cat's eye retro-reflector array coding device and method of fabrication
US6998074B1 Method for forming polymer microspheres
US6672129B1 Method for calibrating a sensor for measuring concentration of odors
US6390453B1 Method and apparatus for delivery of fragrances and vapors to the nose
US6378988B1 Cartridge element for micro jet dispensing
US6339897B1 Method and apparatus for dispensing airborne materials for controlling pests
US6805902B1 Precision micro-optical elements and the method of making precision micro-optical elements
US6440212B1 Low cost method for making thermoelectric coolers
US6625351B2 Ink-jet printing of collimating microlenses onto optical fibers
US6334851B1 Method for collecting interstitial fluid from the skin
US6338715B1 Digital olfactometer and method for testing olfactory thresholds
US6367925B1 Flat-sided fluid dispensing device
US6267724B1 Implantable diagnostic sensor
US6334980B1 Flexible apparatus with ablation formed chamber(s) for conducting bio-chemical analyses
US6077380A Method of forming an adhesive connection
US6114187A Method for preparing a chip scale package and product produced by the method
US6029896A Method of drop size modulation with extended transition time waveform
US6325475B1 Devices for presenting airborne materials to the nose
US6188416B1 Orifice array for high density ink jet printhead
US6015083A Direct solder bumping of hard to solder substrate