| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | Australia | 4 | |
| #3 | EPO (European Patent Office) | 4 | |
| #4 | Taiwan | 4 | |
| #5 | WIPO (World Intellectual Property Organization) | 4 | |
| #6 | China | 3 | |
| #7 | Israel | 3 | |
| #8 | Canada | 2 | |
| #9 | Republic of Korea | 2 | |
| #10 | Mexico | 2 | |
| #11 | Norway | 2 | |
| #12 | African Regional Industrial Property Organization | 1 | |
| #13 | Costa Rica | 1 | |
| #14 | Finland | 1 | |
| #15 | Hong Kong | 1 | |
| #16 | Morocco | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Textiles and paper | |
| #3 | Audio-visual technology | |
| #4 | Optics | |
| #5 | Micro-structure and nano-technology | |
| #6 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ross Richard J | 31 |
| #2 | Shaffer Tony B | 10 |
| #3 | Ross Cynthia L | 10 |
| #4 | Ni John Qiang | 9 |
| #5 | Mellen K Scott | 8 |
| #6 | Bregante Raymond S | 8 |
| #7 | Shaffer Tony | 8 |
| #8 | Alering Troy | 3 |
| #9 | Ross R J | 2 |
| #10 | Richard J Ross | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2003013234A1 | Use of diverse materials in air-cavity packaging of electronic devices | |
| US6214152B1 | Lead frame moisture barrier for molded plastic electronic packages | |
| AU4749997A | Inverted stamping process | |
| TW376573B | Electronic packages containing microsphere spacers | |
| AU3742097A | Electronic packages containing microsphere spacers | |
| US5572070A | Integrated circuit packages with heat dissipation for high current load | |
| EP0450713A1 | Iso-thermal seal process for electronic devices |