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MICROCOMPOSANTS DE HAUTE SECUR

Overview
  • Total Patents
    14
About

MICROCOMPOSANTS DE HAUTE SECUR has a total of 14 patent applications. Its first patent ever was published in 2006. It filed its patents most often in France, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, computer technology and measurement are ESEC SEMPAC SA, MICROARRAY CO LTD and DYNACARD CO LTD.

Patent filings in countries

World map showing MICROCOMPOSANTS DE HAUTE SECURs patent filings in countries

Patent filings per year

Chart showing MICROCOMPOSANTS DE HAUTE SECURs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tauzinat Pierre 7
#2 Bocquene Dominique 7
#3 Gadot Gerard 6
#4 Tregret Joseph 3
#5 Charpentier Alain 2
#6 Le Mouellic Christian 2
#7 Briere Olivier 1
#8 Rodde Klaus 1
#9 Saubat Jean Claude 1

Latest patents

Publication Filing date Title
FR2914087A1 Method for manufacturing radio label
FR2913144A1 N type MOSFET e.g. depletion MOSFET, fabricating method, involves depositing monocrystalline semiconductor material layer on FET by argon plasma spraying, at deposition speed that is less than deposited atom homogenizing speed
FR2911191A1 Sensor for measuring a dose of uv and method for measuring a dose of uv implementing said sensor
FR2911129A1 Microelectromechanical system type micro-relay for integrated circuit, has upper and lower contacts short-circuited when electrode is placed against upper and lower contacts, respectively, and cells ensuring lateral locking of electrode
FR2907939A1 Electronic label for monitoring and controlling the cold chain and method for controlling temperature thereof
FR2906646A1 Individual marking process for integrated circuits and integrated circuit marked thereby.
FR2905521A1 Method of marking a semiconductor plate for its identification and semiconductor plate marked thereby
FR2904727A1 Method for cutting electronic elements belonging to a semiconductor plate
FR2904472A1 Method for manufacturing encapsule integrated circuit and integrated encapsule integrated circuit
FR2899366A1 Method for attaching to a product a circuit for authenticating the product and product obtained by carrying out said method