| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Australia | 1 | |
| #4 | China | 1 | |
| #5 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Machines | |
| #3 | Thermal processes | |
| #4 | Semiconductors | |
| #5 | Materials and metallurgy | |
| #6 | Chemical engineering | |
| #7 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Haringer Stephan | 5 |
| #2 | Scala Roberto | 4 |
| #3 | Giannattasio Armando | 3 |
| #4 | Bovo Rodolfo | 3 |
| #5 | Moser Valentino | 3 |
| #6 | Bonanno Luigi | 3 |
| #7 | Fumagalli Matteo | 2 |
| #8 | Pazzaglia Gianluca | 2 |
| #9 | Fisher Graham | 1 |
| #10 | Falster Robert | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN108103572A | For the liquid doped system and method for the controlled doping of single-crystal semiconductor material | |
| US2014361408A1 | Oxygen precipitation in heavily doped silicon wafers sliced from ingots grown by the Czochralski method | |
| KR20180125039A | Systems and methods for controlling surface profiles of wafers sliced in a wire saw |