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MEC CO LTD

Overview
  • Total Patents
    410
  • GoodIP Patent Rank
    10,394
  • Filing trend
    ⇧ 9.0%
About

MEC CO LTD has a total of 410 patent applications. It increased the IP activity by 9.0%. Its first patent ever was published in 1982. It filed its patents most often in Republic of Korea, Taiwan and United States. Its main competitors in its focus markets surface technology and coating, audio-visual technology and basic materials chemistry are MEC KK, MEKKU KK and FENG KESHENG.

Patent filings per year

Chart showing MEC CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Akiyama Daisaku 60
#2 Kawaguchi Mutsuyuki 32
#3 Amitani Yasutaka 31
#4 Sengoku Yoichi 31
#5 Amatani Tsuyoshi 29
#6 Nakagawa Toshiko 28
#7 Saito Satoshi 27
#8 Ogino Yuki 24
#9 Ishida Terukazu 24
#10 Otani Minoru 23

Latest patents

Publication Filing date Title
WO2020170638A1 Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body
WO2020116349A1 Copper powder for 3d printing, method for producing copper powder for 3d printing, method for producing 3d printed article, and 3d printed article
JP2020094271A Copper powder for laminate molding, method for producing copper powder for laminate molding, method for producing lamination molding object and laminate molding object
JP2020067515A Manufacturing method of printed wiring board
EP3702049A1 Method for producing film formation substrate, film formation substrate, and surface treatment agent
JP2020010666A Music provision system for non-human animal
JP2019123228A Integrated molding and method for producing the same, and primer composition
JP2019199641A Method for manufacturing surface modified molding
JP2019060013A Copper micro etching agent
KR101948770B1 Expansion joint installation method and expansion joint structure using the same
JP2019108587A Metal powder and method for producing the same, and lamination-molded article and method for producing the same
JP2019059962A Copper surface roughening method and method for producing wiring board
JP2019039027A Copper micro etching agent and method for producing wiring board
JP2017226912A Method for producing metal particle
JP2018193602A Etchant, feeding liquid, and method for forming copper wiring
JP2018188715A Composition for film formation, production method of surface treatment metallic component, and production method of metal-resin composite
KR101806908B1 M-joint system
KR101778974B1 Mortar gun apparatus
WO2017141799A1 Microetchant for copper and method for producing wiring board
JP2017150069A Micro etching agent of copper and manufacturing method of wiring board