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J G SYSTEMS INC

Overview
  • Total Patents
    38
About

J G SYSTEMS INC has a total of 38 patent applications. Its first patent ever was published in 1997. It filed its patents most often in Israel, United States and Australia. Its main competitors in its focus markets audio-visual technology, surface technology and coating and machine tools are TSUDA MINORU, MACDERMID INC and PHOTOCIRCUITS CORP.

Patent filings in countries

World map showing J G SYSTEMS INCs patent filings in countries

Patent filings per year

Chart showing J G SYSTEMS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Grunwald John 12
#2 Grunwald John J 4

Latest patents

Publication Filing date Title
US2013344235A1 Autocatalytic electroless copper using hypophosphite reducer
IL204422D0 METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn
IL200772D0 A method and composition to repair pinholes and microvoids in immersion silver plated pwb's
US2006027534A1 CMP composition containing organic nitro compounds
IL161771D0 Method and composition to minimize dishing in semiconductor wafer processing
IL157681D0 Improved abrasives for chemical-mechanical polishing applications
IL156485D0 Cmp pad with long user life
IL156094D0 Fixed abrasive cmp pad with built-in additives
US6805911B2 Method and apparatus for improving interfacial chemical reactions
IL155554D0 Chemical-mechanical polishing composition and process
IL154782D0 Chemical-mechanical polishing composition containing organic nitro compounds
IL154783D0 Chemical-mechanical polishing composition based on cupric oxidizing compounds
IL153498D0 Electroless copper metallization of electronic devices
US6599563B2 Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals
IL150577D0 Improved method for electroless plating precious metal sensitization
IL150364D0 A composition and process for electroless plating of non-conductors, especially usli devices, without precious metal sensitization
IL148626D0 Metallization of optical fibers
IL148350D0 Processing and repairing emulsions and microemulsions for use in optical fibers
IL147773D0 Method and composition for electroless deposition of metals using colloidal activators with reduced palladium concentration
IL143684D0 An improved process and composition for electroless deposition of copper on non conductors