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MDS CO LTD

Overview
  • Total Patents
    33
  • GoodIP Patent Rank
    159,756
About

MDS CO LTD has a total of 33 patent applications. Its first patent ever was published in 2011. It filed its patents most often in Republic of Korea, China and Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and measurement are ASE SHANGHAI INC, EASTERN KK and RISING TECH CO LTD.

Patent filings in countries

World map showing MDS CO LTDs patent filings in countries

Patent filings per year

Chart showing MDS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jang Jae Hoon 5
#2 Kwon Soon Chul 5
#3 Bae In Seob 4
#4 Jin Min Seok 4
#5 Kang Sung Il 4
#6 Seol Jeong Hoon 3
#7 Yu Dong Guk 3
#8 Yu Sang Soo 3
#9 Kim Ki Soo 2
#10 Kim Jin Hong 2

Latest patents

Publication Filing date Title
KR101568394B1 Printed Circuit Board for manufacturing integrated circuit device
KR20150135003A Printed circuit board for mounting semiconductor chip
KR20150134699A Method of manufacturing circuit board
KR20150108691A Bleed-out preventing agent, composition for preventing bleed-out including the same and method for preventing bleed-out
KR20150101314A Roll brush for grinding
KR20150083401A Method for manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
KR20150083402A Method for manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
KR20150081147A Method for manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
KR20150081145A Lead frame and semiconductor chip package including the same
KR20150081146A Method for manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
KR20150050089A Lead frame for light emitting device package, manufacturing method thereof, and manufacturing method light emitting device package
KR20150049644A Lead frame, light emitting diode package including the lead frame, and method of manufacturing the lead frame
KR20140134564A Apparatus for grinding surface of substrate
KR20140132229A Method for forming hole in substrate and apparatus for forming hole in substrate
KR20140131777A Method for manufacturing lead frame
KR20140122614A Etchant composition for copper-containing metal film and etching method using the same
KR20140121195A Etchant composition for copper-containing metal film and etching method using the same
KR20140121196A Etchant composition for copper-containing metal film and etching method using the same
KR20140120737A substrate roll, plasma treatment method thereof and apparatus for plasma treatment
KR20140088732A Method of manufacturing circuit board and chip package