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QIDING TECH QINHUANGDAO CO LTD

Overview
  • Total Patents
    19
  • GoodIP Patent Rank
    89,093
  • Filing trend
    ⇧ 50.0%
About

QIDING TECH QINHUANGDAO CO LTD has a total of 19 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and thermal processes are RISING TECH CO LTD, ASE SHANGHAI INC and SUMITOMO METAL SMI ELECTRON DE.

Patent filings in countries

World map showing QIDING TECH QINHUANGDAO CO LTDs patent filings in countries
# Country Total Patents
#1 China 19

Patent filings per year

Chart showing QIDING TECH QINHUANGDAO CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Huang Yucheng 15
#2 Chen Yihe 3
#3 Ye Zijian 2
#4 Huang Shifu 2
#5 Su Weishuo 2
#6 Xu Maofeng 1
#7 Liang Guosheng 1
#8 Pan Meiru 1
#9 Tang Chihua 1

Latest patents

Publication Filing date Title
CN111194141A Circuit board and manufacturing method thereof
CN111092023A Package substrate and manufacturing method thereof
CN110484171A Resin combination, peelable glue-line, IC support plate and IC package processing procedure
CN108666293A Line carrier plate and its manufacturing method
CN108461405A Line carrier plate and its manufacturing method
CN108260060A MEMS microphone package structure and preparation method thereof
CN108257875A The production method of chip package base plate, chip-packaging structure and the two
CN108242400A Encapsulating carrier plate and its manufacturing method
CN108242407A Package substrate, encapsulating structure and preparation method thereof
CN108235557A Flexible support plate and its manufacturing method
CN107611036A Package substrate and preparation method thereof, encapsulating structure
CN107527824A Has gelled encapsulating carrier plate and preparation method thereof
CN106817835A Circuit board and preparation method thereof
CN106571355A Chip package substrate manufacturing method and chip package substrate
CN106548945A The manufacture method and chip package base plate of chip package base plate
CN106486382A Base plate for packaging, encapsulating structure and preparation method thereof
CN106449584A IC support plate, packaging structure possessing IC support plate and manufacturing method of packaging structure
CN107027264A Fin and preparation method thereof and electronic equipment