| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 | |
| #2 | Republic of Korea | 2 | |
| #3 | Austria | 1 | |
| #4 | China | 1 | |
| #5 | Germany | 1 | |
| #6 | EPO (European Patent Office) | 1 | |
| #7 | Finland | 1 | |
| #8 | France | 1 | |
| #9 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Semiconductors | |
| #3 | Machines | |
| #4 | Environmental technology | |
| #5 | Engines, pumps and turbines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tuominen Risto | 14 |
| #2 | Iihola Antti | 8 |
| #3 | Palm Petteri | 7 |
| #4 | Waris Tuomas | 4 |
| #5 | Kujala Arni | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2016174387A1 | Method for fabrication of an electronic module and electronic module | |
| US2014254107A1 | Electronic module with embedded jumper conductor | |
| US2014131870A1 | Multi-chip package and manufacturing method |