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NODA SCREEN KK

Overview
  • Total Patents
    53
  • GoodIP Patent Rank
    191,742
About

NODA SCREEN KK has a total of 53 patent applications. Its first patent ever was published in 1988. It filed its patents most often in Japan. Its main competitors in its focus markets audio-visual technology, semiconductors and electrical machinery and energy are HSU SHIH-PING, DINGFENG WANG and ASE SHANGHAI INC.

Patent filings in countries

World map showing NODA SCREEN KKs patent filings in countries
# Country Total Patents
#1 Japan 53

Patent filings per year

Chart showing NODA SCREEN KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ogawa Hiroyoshi 29
#2 Noda Masanori 7
#3 Oshima Yasuhiro 7
#4 Nishimatsu Daisuke 5
#5 Oyamada Shigemasa 4
#6 Yoshizawa Masamitsu 4
#7 Yamamoto Hisatomi 4
#8 Hattori Atsunori 4
#9 Ogawa Hirotaka 3
#10 Chiisagata Hideaki 3

Latest patents

Publication Filing date Title
JP2015212369A Resin composition, resin composition solution, coating film and coating
JP2015212370A Curable resin composition, curable resin composition solution, cured coating and curable coating
JP2016039283A Method of manufacturing thin film capacitor sheet
JP2016023277A Sulfurization prevention coating agent
JP2016023276A Sulfurization prevention coating agent
JP2015140351A Coating agent and forming method of coating film
JP2015082516A Multilayer circuit board
JP2015065199A Multilayer wiring board and method of manufacturing the same
JP2015026630A Semiconductor device
JP2014037511A Method for forming coating film and coating agent
JP2013245314A Coating agent
JP2013245316A Coating agent
JP2013239530A Semiconductor device
JP2012180451A Fluorescent compound, fluorescent polymer, and coating agent
JP2012017438A Fluorine-based copolymer, method for producing the same and coating agent
JP2011099077A Fluoropolymer and coating agent
JP2011100930A Protective insulation material for circuit board
JP2008141121A Passive element sheet, and semiconductor package
JP2007046155A Film deposition method and film deposition apparatus
JP2008004688A Semiconductor package