| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 8 | |
| #2 | Germany | 6 | |
| #3 | Taiwan | 5 | |
| #4 | EPO (European Patent Office) | 4 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Chemical engineering | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Cleaning | |
| #3 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Speh Ulrich | 7 |
| #2 | Lohmueller Juergen | 4 |
| #3 | Naegele Eberhard | 4 |
| #4 | Oshinowo John | 3 |
| #5 | Henson David | 3 |
| #6 | Kohler Laurence | 3 |
| #7 | Mann Klaus | 3 |
| #8 | Pesce Robert | 3 |
| #9 | Schenkl Manfred | 3 |
| #10 | Wehrle Felix | 3 |
| Publication | Filing date | Title |
|---|---|---|
| DE10256696A1 | Process for drying substrates | |
| DE10239578A1 | Device and method for treating substrates | |
| DE10200525A1 | Device and method for treating disc-shaped substrates | |
| DE10155548A1 | Device for treating substrates | |
| DE10122669A1 | Device for wet cleaning of disc-shaped substrates | |
| WO0184598A1 | Method and device for treating slice-type substrates | |
| DE10103111A1 | Device for treating substrates |