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LTRIN CO LTD

Overview
  • Total Patents
    25
  • GoodIP Patent Rank
    172,512
About

LTRIN CO LTD has a total of 25 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, chemical engineering and packaging and shipping are SCIENTECH CORP, CHEN MING-FA and NEC FUKUOKA LTD.

Patent filings in countries

World map showing LTRIN CO LTDs patent filings in countries

Patent filings per year

Chart showing LTRIN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cha Yong Won 16
#2 Park Sang Su 7
#3 Kim In Sung 6
#4 Park Gun Woo 6
#5 Shin Ho Jun 5
#6 Yoo Sang Wook 4
#7 Jung Seung Hee 4
#8 Oh Sang Jun 3
#9 Park Jae In 3
#10 Lee Yeon Jong 3

Latest patents

Publication Filing date Title
KR20210026626A The debonding method for the bonded substrates
KR20200073482A Substrate bonding apparatus
KR20170020268A Wafer bonder and coil block apparatus using electromagnetic wave heating
KR20170117759A Apparatus and method for substrates bonding
KR20160115192A Apparatus and method for substrates bonding
KR20150136848A Apparatus for substrates bonding
KR20150136847A Apparatus and method for substrates bonding
KR20150131868A Apparatus for substrates bonding
US2014322834A1 Apparatus and method for bonding substrates
KR20150060458A Apparatus for substrates bonding
KR20150049726A Apparatus for substrates bonding
KR20130045536A Apparatus for bonding substrates and method of bonding substrates
KR20130009200A Apparatus for adjusting coil and substrate bonding chamber using the same
KR20120118968A Pressure distributor device for bonding substrate and method thereof
KR20120007184A Epitaxial wafer package and manufacturing method therefor
KR20110107923A Pressure control type device for bonding substrates and method therefor
KR101017361B1 Substrate bonding system and portable chamber therefor
KR20100092785A Glass substrate cleaning method
KR100886957B1 Wafer bonding module and method of wafer bonding using the same
KR100872908B1 Wafer surface treatment device