| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 10 | |
| #2 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Cai Jun | 2 |
| #2 | Estacio Maria Cristina B | 2 |
| #3 | Joshi Rajeev D | 1 |
| #4 | Zhu Adams | 1 |
| #5 | Jereza Armand Vincent C | 1 |
| #6 | Rios Margie T | 1 |
| #7 | Chong David Sooklim | 1 |
| #8 | Lee Sang-Do | 1 |
| #9 | Noquil Jonathan A | 1 |
| #10 | Liu Yong | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2010109134A1 | Pre-molded, clip-bonded multi-die semiconductor package | |
| TW200805532A | Semiconductor device with solderable loop contacts | |
| TW200742017A | Aluminum bump bonding for fine aluminum wire | |
| TW200739758A | Device and method for assembling a top and bottom exposed packaged semiconductor |