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LIN CHUN-HUNG

Overview
  • Total Patents
    20
About

LIN CHUN-HUNG has a total of 20 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States and Taiwan. Its main competitors in its focus markets thermal processes, semiconductors and machines are COMPTAKE TECHNOLOGY INC, MAKI HIROSHI and UNISTARS.

Patent filings in countries

World map showing LIN CHUN-HUNGs patent filings in countries
# Country Total Patents
#1 United States 19
#2 Taiwan 1

Patent filings per year

Chart showing LIN CHUN-HUNGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lin Chun-Hung 20
#2 Chen Han-Lin 3
#3 Chen Chang-Yin 3
#4 Shen Geng-Shin 2
#5 Pu Han-Ping 2
#6 Chen Yu-Feng 2
#7 Chen Hsien-Wei 1
#8 Lee Chun-Yi 1
#9 Shieh Tung-Yang 1
#10 Kuo Hung-Jui 1

Latest patents

Publication Filing date Title
TW201429794A Vehicle driving device and method thereof
US2013175705A1 Stress compensation layer for 3D packaging
US2013118717A1 Heat-dissipating device and method for fabricating the same
US2013119532A1 Bumps for Chip Scale Packaging
US2013048249A1 Heat pipe manufacturing method and heat pipe thereof
US2013048247A1 Heat pipe manufacturing method and heat pipe thereof
US2013048248A1 Heat pipe manufacturing method and heat pipe thereof
US2013000872A1 Fin Heat Sink with Improved Structure and Processing Method Thereof
US2012318480A1 Heat sink having juxtaposed heat pipes and method for manufacturing the same
US2011065758A1 Compositions and assays for treatment and diagnosis of helicobacter pylori infection and conditions
US2010113519A1 1,5-dideoxy-1,5-imino-D-glucitol compounds
US2008048410A1 Bicycle tube connector
US2007228689A1 Bicycle frame tube structure for enhancing the rigidity of the bicycle frame
US2007229139A1 Level shifter circuit with a wide operating voltage range
US2007080435A1 Semiconductor packaging process and carrier for semiconductor package
US2007063344A1 Chip package structure and bumping process