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LAM RES CORP

Overview
  • Total Patents
    12,205
  • GoodIP Patent Rank
    274
  • Filing trend
    ⇧ 2.0%
About

LAM RES CORP has a total of 12,205 patent applications. It increased the IP activity by 2.0%. Its first patent ever was published in 1981. It filed its patents most often in United States, Taiwan and Republic of Korea. Its main competitors in its focus markets semiconductors, electrical machinery and energy and surface technology and coating are BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD, MATTSON TECH INC and BEIJING NMC CO LTD.

Patent filings in countries

World map showing LAM RES CORPs patent filings in countries

Patent filings per year

Chart showing LAM RES CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Dhindsa Rajinder 524
#2 Lavoie Adrien 352
#3 Singh Harmeet 288
#4 Fischer Andreas 283
#5 Marakhtanov Alexei 272
#6 Paterson Alex 246
#7 Redeker Fred C 234
#8 Bailey Iii Andrew D 222
#9 Shih Hong 220
#10 Lill Thorsten 218

Latest patents

Publication Filing date Title
WO2021081304A1 Radio frequency (rf) power imbalancing in a multi-station integrated circuit fabrication chamber
WO2021081213A1 Determination of recipe for manufacturing semiconductor
WO2021081123A1 Semiconductor equipment module fabrication with additive manufacturing
WO2021080953A1 Monolithic anisotropic substrate supports
WO2021081000A1 Heat and volatile-organic-compounds detecting systems
WO2021076746A1 Selective attachment to enhance sio2:sinx etch selectivity
WO2021076636A1 Molybdenum fill
WO2021076527A1 Dual plenum fractal showerhead
WO2021071999A1 Semiconductor substrate bevel cleaning
WO2021072042A1 Positive tone development of cvd euv resist films
WO2021072040A1 Inorganic coating of plasma chamber component
WO2021071767A1 Autoclean for load locks in substrate processing systems
WO2021071765A1 Power source isolation circuits for heater elements of substrate supports of substrate processing systems
WO2021067632A2 Substrate surface modification with high euv absorbers for high performance euv photoresists
WO2021067419A1 Wafer shielding for prevention of lipseal plate-out
WO2021067239A1 Metrology module with parallel acquisition of broadband polarized spectra
WO2021076321A1 In-situ monitoring of substrate surfaces
WO2021067160A1 Radio frequency distribution circuits including transformers and/or transformer coupled combiners
WO2021061907A1 Tunable and non-tunable heat shields to affect temperature distribution profiles of substrate supports
WO2021067118A1 Selective graphene deposition using remote plasma