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KYOWA ELECTRIC WIRE

Overview
  • Total Patents
    76
About

KYOWA ELECTRIC WIRE has a total of 76 patent applications. Its first patent ever was published in 1975. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, surface technology and coating and optics are TGO TECH CORP, NOVELLUS SYSTEMS INC and BLUE29 LLC.

Patent filings in countries

World map showing KYOWA ELECTRIC WIREs patent filings in countries
# Country Total Patents
#1 Japan 76

Patent filings per year

Chart showing KYOWA ELECTRIC WIREs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kuroba Toshiaki 20
#2 Sugie Kinya 19
#3 Ikegami Seiji 18
#4 Uda Yoshito 14
#5 Yasuoka Noriaki 14
#6 Sato Masahiro 9
#7 Minamiguchi Hiroshi 7
#8 Ogura Kunio 6
#9 Ito Noboru 5
#10 Nakada Katsumi 5

Latest patents

Publication Filing date Title
JP2013026077A Covered wire and manufacturing method therefor
JP2012252798A Electric wire
JP2012226994A Connector structure and female contact
JP2012146473A Multi-core electric wire
JP2012140678A Plated member for preventing occurrence of whisker in bending part, electric electronic component using the same, method for producing plated member, and method for preventing occurrence of whisker in plated member
JP2012107263A Plating structure and coating method
JP2012099219A Aluminum wire and connection terminal structure
JP2011122234A Plating structure and method for manufacturing electric material
JP2010280955A Plated connecting terminal member, connecting terminal using the same, plated material and multilayer plated material used for the same and method of manufacturing plated connecting terminal member
JP2010265540A Lead frame, manufacturing method therefor, electronic parts and electronic device using the same, and plated material to be used in them
JP2010084228A Lead frame material and semiconductor device using the same
JP2008066493A Lead wire, lead terminal for aluminum electrolytic capacitors, and aluminum electrolytic capacitor
JP2006223956A Polluted soil modifying method
JP2005072295A Tape carrier structure and its making method
JP2004238689A Plating material, terminal for electronic component, connector, lead member, and semiconductor device
JP2004029127A Optical waveguide element and optical element module
JP2003105586A Lead member for electronic part and method of manufacturing this lead member
JP2001107290A Tinned bar stock for electronic parts and its producing method
JP2000260230A Lead wire hardly polluting molten solder bath and its soldering method
JPH11108252A Bulkhead pipe and manufacture thereof