METALOR TECHNOLOGIES JAPAN CORP has a total of 20 patent applications. Its first patent ever was published in 2006. It filed its patents most often in Taiwan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets surface technology and coating, semiconductors and audio-visual technology are SES CO LTD, NOVELLUS SYSTEMS INC and FURUYA AKIRA.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 10 | |
#2 | WIPO (World Intellectual Property Organization) | 4 | |
#3 | China | 2 | |
#4 | EPO (European Patent Office) | 1 | |
#5 | Japan | 1 | |
#6 | Republic of Korea | 1 | |
#7 | Singapore | 1 |
# | Industry | |
---|---|---|
#1 | Surface technology and coating | |
#2 | Semiconductors | |
#3 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Electrolytic coating production | |
#3 | Coating metallic material | |
#4 | Casings and printed circuits |
# | Name | Total Patents |
---|---|---|
#1 | Furukawa Masato | 5 |
#2 | Nakamura Hiroshi | 4 |
#3 | Yamada Takashi | 4 |
#4 | Matsumoto Takeshi | 2 |
#5 | Ishizaki Shoji | 2 |
#6 | Son Injoon | 2 |
#7 | Nakamura Yuuki | 2 |
#8 | Nakamura Yuki | 2 |
#9 | Son In-Joon | 1 |
#10 | Yuki Nakamura | 1 |
Publication | Filing date | Title |
---|---|---|
WO2015190218A1 | Cyanide electrolytic gold plating bath and bump formation method using same | |
WO2014162935A1 | Electroless platinum plating solution and electroless platinum plating method using said plating solution | |
WO2013094544A1 | Electroless platinum plating solution, method for producing same, and method for forming platinum film | |
CN103290440A | Non-cyanide gold electroplating bath for formation of gold bumps and formation method of gold bumps | |
KR20130095481A | Non cyanide gold plating bath for bump and forming method of gold bump | |
TW201331427A | Preparation method of non - cyanide electrolytic gold plating bath and gold bump for forming gold bump | |
WO2011118537A1 | Cyanide based electrolytic gold plating solution and plating method using same | |
JP2012117113A | Non-cyanide gold electroplating bath for gold bump formation and method for forming gold bump |