| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 8 | |
| #2 | Singapore | 3 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | China | 2 | |
| #5 | Australia | 1 | |
| #6 | EPO (European Patent Office) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Semiconductors | |
| #3 | Machine tools | |
| #4 | Machines | |
| #5 | Micro-structure and nano-technology | |
| #6 | Electrical machinery and energy | |
| #7 | Chemical engineering |
| # | Name | Total Patents |
|---|---|---|
| #1 | Deyoung James P | 4 |
| #2 | Wagner Mark I | 4 |
| #3 | Kolics Artur K | 3 |
| #4 | Li Shijian | 3 |
| #5 | Ivanov Igor C | 3 |
| #6 | Arunagiri Tiruchirapalli N | 3 |
| #7 | Xu Cangshan | 2 |
| #8 | Owczarz Aleksander | 2 |
| #9 | Zhao Yuexing | 2 |
| #10 | Boyd John M | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2010184301A1 | Methods for Preventing Precipitation of Etch Byproducts During an Etch Process and/or Subsequent Rinse Process | |
| US2010062164A1 | Methods and Solutions for Preventing the Formation of Metal Particulate Defect Matter Upon a Substrate After a Plating Process | |
| US2008149147A1 | Proximity head with configurable delivery | |
| US6569004B1 | Polishing pad and method of manufacture |