| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 17 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Computer technology | |
| #3 | Semiconductors | |
| #4 | Foods and drinks | |
| #5 | Optics | |
| #6 | Environmental technology |
| # | Technology | |
|---|---|---|
| #1 | Static stores | |
| #2 | Television | |
| #3 | Semiconductor devices | |
| #4 | Special information storage | |
| #5 | Cameras | |
| #6 | Special foods | |
| #7 | Casings and printed circuits | |
| #8 | Electric digital data processing | |
| #9 | Foods | |
| #10 | Climate change mitigation in goods production |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kim Hye-Jin | 17 |
| #2 | Kim Du-Eung | 5 |
| #3 | Lee Kwang-Jin | 4 |
| #4 | Choi Jun-Ho | 3 |
| #5 | Eun Sung-Ho | 2 |
| #6 | An Hung-Jun | 2 |
| #7 | Choi Na-Ri | 2 |
| #8 | Kim Byung-Seo | 2 |
| #9 | Kang Sang-Kyu | 1 |
| #10 | Kwon Oran | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2012224437A1 | Non-volatile memory device using variable resistance element with an improved write performance | |
| US2010090324A1 | Semiconductor package having solder ball which has double connection structure |