K9 FLIP CHIP TECHNOLOGY innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	Republic of Korea	13

#	Technology
#1	Semiconductor devices
#2	Television
#3	Casings and printed circuits
#4	Cameras
#5	Constructional instrument details
#6	Optical systems
#7	Laundering textiles
#8	Sanitary equipment
#9	Shaping of plastics

Publication	Filing date	Title
KR20080078315A	2007-02-23	Camera module for selecting filters
KR20080068770A	2007-01-20	Smt type camera module of csp package
KR100801642B1	2006-12-12	Camera module with ir filter blanket
KR20080044927A	2006-11-17	Smt type camera module for improving connection with pcb
KR100817143B1	2006-09-30	Slim camera module of mobile phone
KR20060110249A	2006-09-11	Press cure system for housing attachment of camera module, and cure method using it
KR20060104962A	2006-09-05	Device for camera module
KR20070096503A	2006-03-24	Device for camera module and camera module using the same
KR20050050155A	2004-05-28	Flip chip bondig method for enhancing the performance of connection in flip chip packaging process and layered metal architecture of substrate for stud bump
KR20050001523A	2003-06-25	Layered metal architecture of substrate for stud bump
KR20040083899A	2003-03-25	Flip Chip Packaging Method for Enhancing the Performance of Connection
KR20040083898A	2003-03-25	Flip Chip Packaging Method using Dam
KR20040083897A	2003-03-25	Flip Chip Packaging Method and LED Packaging Structure using thereof