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AZUREWAVE TECHNOLOGIES INC

Overview
  • Total Patents
    128
  • GoodIP Patent Rank
    141,855
  • Filing trend
    ⇧ 50.0%
About

AZUREWAVE TECHNOLOGIES INC has a total of 128 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 2005. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors, audio-visual technology and computer technology are K9 FLIP CHIP TECHNOLOGY, IWATE TOSHIBA ELECTRONICS CO and ALTUS TECHNOLOGY INC.

Patent filings in countries

World map showing AZUREWAVE TECHNOLOGIES INCs patent filings in countries

Patent filings per year

Chart showing AZUREWAVE TECHNOLOGIES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Huang Zhong-E 21
#2 Zhonge Huang 15
#3 Hsu Chi-Hsing 14
#4 Lee Ching-Hsiang 14
#5 Huang Chung-Er 11
#6 Chou Chih-Chiang 6
#7 Chen Sheng-Wen 6
#8 Lin Kung-An 5
#9 Chien Huang-Chan 5
#10 Lee Tseng-Chieh 4

Latest patents

Publication Filing date Title
TWI705243B Detecting method for high transmittance glass and glass detection apparatus by excitation
TWI677745B Image capturing module and portable electronic device
TWI691671B Flip-chip light-emitting module
TWI685125B Image capturing module and portable electronic device
TW202001951A Holder, optical component and optical module
TW202001952A Optical element, optical component and optical module
TWI662724B Flip-chip light-emitting module
TWI647828B Portable electronic device and image capturing module and image sensing component thereof
TWI639048B Portable electronic device and image-capturing module thereof, and carrier assembly thereof
TW201901941A Portable electronic device and image capturing module and bearing component thereof
TWI635348B Portable electronic device and image-capturing module thereof, and carrier assembly thereof
CN104767572A Interstage tester of wireless communication device
TW201525481A A inter-stage test structure for a wireless communication apparatus
US2015131230A1 Module IC package structure and method for manufacturing the same
US2015130034A1 Module IC package structure
US2015130033A1 Module ic package structure with electrical shielding function and method for manufacturing the same
CN104576617A Module integrated circuit packaging structure and fabricating method thereof
TW201515182A Module IC package structure with electrical shielding function and method of making the same
TW201515168A Module ic package structure for increasing heat-dissipating efficiency and method of making the same
TW201513295A Module ic package structure with electrical shielding function and method of making the same