Learn more

JINAN NANZHI INFORMATION TECH CO LTD

Overview
  • Total Patents
    31
  • GoodIP Patent Rank
    49,937
About

JINAN NANZHI INFORMATION TECH CO LTD has a total of 31 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, electrical machinery and energy and micro-structure and nano-technology are GUANGDONG FOZHIXIN MICROELECTRONICS TECH RESEARCH CO LTD, SAITO WATARU and SUZHOU GOOD-ARK ELECTRONICS CO LTD.

Patent filings in countries

World map showing JINAN NANZHI INFORMATION TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 31

Patent filings per year

Chart showing JINAN NANZHI INFORMATION TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hou Xinfei 16
#2 Qin Ling 8
#3 Yang Zhenzhou 6
#4 Cui Wenjie 6
#5 Li Langui 2
#6 Cui Yanguang 1

Latest patents

Publication Filing date Title
CN112234131A Chip-on-board packaging structure and manufacturing method thereof
CN112234130A COB packaging structure and manufacturing method thereof
CN112233990A 5G communication package and manufacturing method thereof
CN112259464A 5G communication module and manufacturing method thereof
CN112018058A Power inverter module and manufacturing method thereof
CN112013982A Embedded platinum galvanic couple sensor
CN112002677A RF communication assembly and manufacturing method thereof
CN111952197A Semiconductor device and packaging method thereof
CN111952198A Semiconductor package and preparation method thereof
CN111883444A Multi-chip stack package and manufacturing method thereof
CN111883446A Electronic assembly and manufacturing method thereof
CN111883445A Stacked electronic assembly and manufacturing method thereof
CN111863739A RF (radio frequency) communication module and manufacturing method thereof
CN111863782A Communication module and method for manufacturing the same
CN111725132A Semiconductor device and manufacturing method thereof
CN111725140A Multi-chip package and manufacturing method thereof
CN111725077A Ball planting mold and ball planting method thereof
CN111653628A Optical communication module and manufacturing method thereof
CN111524896A Memory and manufacturing method thereof
CN111508851A Semiconductor structure and forming method thereof