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CN101819958A
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Lead frame structure for flip chip and etching-plating production method thereof
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CN101814467A
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Package structure of heat radiating plate externally connected with island embedded chip pyramid locking hole heat radiating block convex cylinder
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CN101794749A
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Fully encapsulated type packaging structure of assembled heat dissipation block with mount pad embedded chip
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CN101794743A
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Island embedded chip rightly mounted package structure with reverse T type heat dissipation block
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CN101794746A
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Packaging structure of inverse T-shaped radiating block for chip of printed circuit board
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CN101794747A
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Packaging structure of radiating block with locking hole and convex surface for chip of printed circuit board
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CN101794744A
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Packaging structure of radiating block and convex surface for chip of printed circuit board
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CN101794752A
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Fully encapsulated type packaging structure of assembled/inversely assembled heat dissipation block with mount pad embedded chip
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CN101794745A
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Totally-wrapped packaging structure of radiating block for chip of printed circuit board
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CN101794750A
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Island embedded chip rightly mounted package structure with heat dissipation block
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CN101794751A
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Island embedded chip rightly mounted package structure with rectangular heat dissipation block
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CN101794748A
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Packaging structure of rectangular radiating block for chip of printed circuit board
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CN101819954A
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Island-exposed chip packaging structure with pyramid heat radiating block with locking hole and protruding surface
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