HAKUSAN INC has a total of 15 patent applications. It increased the IP activity by 40.0%. Its first patent ever was published in 2015. It filed its patents most often in Japan, EPO (European Patent Office) and United States. Its main competitors in its focus markets materials and metallurgy and semiconductors are MURAI JUNYA, DOWA ELECTRONICS MATERIALS CO and WITEC CAYMAN PATENTS LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 9 | |
#2 | EPO (European Patent Office) | 2 | |
#3 | United States | 2 | |
#4 | China | 1 | |
#5 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Materials and metallurgy | |
#2 | Semiconductors |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Alloys | |
#3 | Non-metallic elements | |
#4 | Working metallic powder |
# | Name | Total Patents |
---|---|---|
#1 | Tsurumi Shigeyuki | 8 |
#2 | Yasuda Kazumasa | 4 |
#3 | Inagawa Koji | 4 |
#4 | Koyano Mikio | 4 |
#5 | Minamikawa Toshiharu | 4 |
#6 | Matoba Akinari | 4 |
#7 | Toyoda Takeshi | 4 |
#8 | Ueno Shohei | 2 |
#9 | Kobayashi Goshiyo | 2 |
#10 | Shibuya Takashi | 2 |
Publication | Filing date | Title |
---|---|---|
JP2020088018A | Thermoelectric module, thermoelectric element component, thermoelectric element component manufacturing method, and thermoelectric module manufacturing method | |
WO2019039320A1 | Thermoelectric material and thermoelectric module | |
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JP2019016677A | Peltier module and method for manufacturing the same | |
JP2018206716A | Terminal crimp device and terminal crimp method | |
JP2018182090A | Peltier module and manufacturing method of peltier module | |
JP2018124308A | Optical cable cutting tool | |
EP3273494A1 | Method for producing thermoelectric material |