JETEK INC has a total of 13 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States, Australia and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, machine tools and surface technology and coating are Tianjin jinlong welding material co ltd, KINGYOUP OPTRONICS CO LTD and HESSE & KNIPPS GMBH.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 4 | |
#2 | Australia | 3 | |
#3 | WIPO (World Intellectual Property Organization) | 3 | |
#4 | EPO (European Patent Office) | 2 | |
#5 | Japan | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machine tools | |
#3 | Surface technology and coating | |
#4 | Chemical engineering |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Soldering, welding and flame cutting | |
#3 | Coating metallic material | |
#4 | Plasma technique |
# | Name | Total Patents |
---|---|---|
#1 | Bollinger Lynn David | 13 |
#2 | Tokmouline Iskander | 13 |
Publication | Filing date | Title |
---|---|---|
US6955991B2 | Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes | |
WO0188220A1 | System for precision control of the position of an atmospheric plasma jet | |
AU4134401A | Method for rapid thermal processing of substrates | |
US6762136B1 | Method for rapid thermal processing of substrates | |
US6467297B1 | Wafer holder for rotating and translating wafers | |
WO0123130A1 | Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes |