| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 6 | |
| #2 | United States | 2 | |
| #3 | EPO (European Patent Office) | 1 | |
| #4 | Republic of Korea | 1 | |
| #5 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Machines | |
| #4 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits | |
| #3 | Certain plastics | |
| #4 | Layered products | |
| #5 | Shaping of plastics |
| # | Name | Total Patents |
|---|---|---|
| #1 | Okuno Atsushi | 11 |
| #2 | Oyama Noritaka | 9 |
| #3 | Hashimoto Tsunekazu | 4 |
| #4 | Ishikawa Yuki | 4 |
| #5 | Nagai Koichiro | 4 |
| #6 | Fujita Noriko | 4 |
| #7 | Nagai Kouichirou | 2 |
| #8 | Ishikawa Arinori | 1 |
| #9 | Miyawaki Yoshiteru | 1 |
| #10 | Inoue Masajiro | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2003101189A | Copper foil with carrier and printed circuit board using the same | |
| JP2001127087A | Resin sealing method for electronic component | |
| JP2001118865A | Manufacturing method of photoelectric part | |
| JP2001024017A | Electronic parts manufacturing apparatus and method therefor | |
| JP2000332034A | Manufacture of electronic component | |
| US6063646A | Method for production of semiconductor package | |
| US5232651A | Method of sealing electric parts mounted on electric wiring board with resin composition |