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ISHIHARA CHEMICAL CO LTD

Overview
  • Total Patents
    591
  • GoodIP Patent Rank
    11,360
  • Filing trend
    ⇩ 35.0%
About

ISHIHARA CHEMICAL CO LTD has a total of 591 patent applications. It decreased the IP activity by 35.0%. Its first patent ever was published in 1973. It filed its patents most often in Japan, Republic of Korea and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets surface technology and coating, audio-visual technology and basic materials chemistry are PARELEC INC, FCM KK and COSMOS VACUUM TECHNOLOGY CORP.

Patent filings per year

Chart showing ISHIHARA CHEMICAL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tanaka Kaoru 96
#2 Takishita Katsuhisa 80
#3 Kudo Tomio 72
#4 Kawato Yuichi 66
#5 Kobayashi Akio 63
#6 Uchida Mamoru 50
#7 Nishikawa Tetsuji 48
#8 Komatsu Tadao 45
#9 Maeda Yusuke 41
#10 Uchida Ei 41

Latest patents

Publication Filing date Title
WO2020226116A1 Structure provided with copper plating layer or copper alloy plating layer
WO2020158418A1 Electrolytic copper plate or copper alloy plating bath
JP2020125539A Electrolytic copper plating or copper alloy plating bath
JP2019199651A Structure including Sn layer or Sn alloy layer
JP2020188074A Circuit board and method of manufacturing the same
JP2020125516A Tantalum granulated powder and method for producing the same
JP2020084209A Copper fine particle dispersion liquid and method for manufacturing transparent conductive circuit
JP2020063378A Aqueous composition for coated surface
JP2020043234A Manufacture method for conductive circuit and conductive circuit
JP2020009554A Copper paste and conductive film formation method
JP2019196510A Copper nano-powder, copper nano-ink, and conductive film forming method
WO2019198191A1 Ta-nb alloy powder and method for producing same, and anode element for solid electrolytic capacitor
JP2019119901A Method for forming metal film on polyimide resin
JP2019102672A Structure including Sn layer or Sn alloy layer
JP2019075410A Circuit board and manufacturing method thereof
JP2019044247A Heating type displacement tin plating method on aluminum base material
JP2019044092A Lubricant for chain
JP2019019242A Buff polishing method, buff polishing composition, and aqueous emulsified buff polishing composition for automobile painted surface repairing
JP2018204081A Tin displacement plating method on nickel-based basis material
JP2018204064A Copper colloidal catalyst solution for electroless copper plating and electroless copper plating method