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INKTEC CO LTD

Overview
  • Total Patents
    431
  • GoodIP Patent Rank
    9,214
  • Filing trend
    ⇧ 141.0%
About

INKTEC CO LTD has a total of 431 patent applications. It increased the IP activity by 141.0%. Its first patent ever was published in 2000. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets audio-visual technology, basic materials chemistry and surface technology and coating are PARELEC INC, PRINTAR LTD and PRINTCB LTD.

Patent filings per year

Chart showing INKTEC CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chung Kwang Choon 234
#2 Chung Kwang-Choon 160
#3 Yoo Ji Hoon 93
#4 Cho Hyun Nam 83
#5 Cho Hyun-Nam 52
#6 Cho Nam Boo 46
#7 Han Young Koo 37
#8 Kim Su Han 34
#9 Yoo Myung Bong 26
#10 Han Young-Koo 26

Latest patents

Publication Filing date Title
WO2020204679A1 Negative electrode for lithium ion secondary battery, and method for manufacturing same
KR20200099101A Paste composition for outer electrode of inductor
WO2020139007A1 Metallic paint composition and method for manufacturing polymer injection material formed with metal film using same
WO2020106083A1 Method for forming electrode for displays
KR20200060691A An ink composition comprising an encapsulated pigment dispersion and a method for preparing the same
KR20190126266A Method for manufacturing electromagnetic interference shielding film and electromagnetic interference shielding film manufactured thereof
KR20190040154A Manufacturing Method for FPCB and Manufacturing Apparatus for FPCB
WO2019231028A1 Insulation film and method for manufacturing insulation film
KR20190137248A Insulation film and method of manufacturing insulation film
KR20180117550A Manufacturing method of printed circuit board
KR20180105577A EMI shielding apparatus and method for semiconductor chip
KR20180101200A Method for forming fine pattern and etchant composition
CN110494936A The manufacturing method of transfer film including seed layer, using seed layer selective etch circuit board manufacturing method and etchant
WO2018151530A1 Circuit forming method using selective etching of electrically conductive metal thin film seed layer and etching solution composition
WO2018147678A1 Method for forming circuit using seed layer and etching solution composition for selective etching of seed layer
WO2018143718A1 Method for forming coating that blocks electromagnetic waves
KR20190073037A Electromagnetic wave shield film, manufacturing method for printed circuit board and manufacturing method for electromagnetic wave shield film
KR20190063147A Method for manufacturing printed circuit board
WO2018070807A1 Ink container cap for filling ink cartridge
KR20190012300A Method of manufacturing printed circuit board