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HU CHUAN

Overview
  • Total Patents
    34
  • GoodIP Patent Rank
    111,118
  • Filing trend
    ⇩ 83.0%
About

HU CHUAN has a total of 34 patent applications. It decreased the IP activity by 83.0%. Its first patent ever was published in 1991. It filed its patents most often in United States, China and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are VISWANATHAN LAKSHMINARAYAN, ORIENT SEMICONDUCTOR ELECT LTD and UTAC TAIWAN CORP.

Patent filings in countries

World map showing HU CHUANs patent filings in countries
# Country Total Patents
#1 United States 15
#2 China 12
#3 Taiwan 7

Patent filings per year

Chart showing HU CHUANs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hu Chuan 33
#2 Clemons Gregory S 2
#3 Liff Shawna M 2
#4 Chuan Hu 1
#5 Emery Richard D 1
#6 Nair Vijay 1

Latest patents

Publication Filing date Title
CN108380772A A kind of pipe reduction device of automatic charging
CN107757974A A kind of feeding device of sheet material automatic film applicator
TWI637687B Pollination device
CN106983298A A kind of multifunction seat
CN106963191A A kind of side mounted shelf
CN106963192A A kind of side mounted shelf hanger bracket
CN107014183A A kind of vertical yellow sand dryer
CN107403778A Semiconductor substrate and semiconductor board preparation method
CN107403784A Method for manufacturing circuit board and structure
CN107403755A Chip manufacture method
CN105768652A Folding chair frame structure with trapezoidal stool surface
CN105632039A Method for storing and fetching take-out food from intelligent take-out food storage cabinet
TWI578901B Pollination device for Buddha flower
TWI505774B Pollination device
US2014063761A1 Off-plane conductive line interconnects in microelectronic devices
US2014061954A1 Semiconductor device with pre-molding chip bonding
US2013343022A1 Single layer low cost wafer level packaging for SFF SiP
TW201325441A Pollination device
US2012241965A1 Solder in cavity interconnection structures
US2011147440A1 Solder in cavity interconnection technology