| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 4 | |
| #2 | United States | 4 | |
| #3 | China | 1 | |
| #4 | EPO (European Patent Office) | 1 | |
| #5 | Japan | 1 | |
| #6 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Materials and metallurgy | |
| #2 | Audio-visual technology | |
| #3 | Semiconductors | |
| #4 | Foods and drinks | |
| #5 | Machines | |
| #6 | Thermal processes | |
| #7 | Furniture and games | |
| #8 | Civil engineering |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Working metallic powder | |
| #3 | Semiconductor devices | |
| #4 | Foods | |
| #5 | Kitchen equipment | |
| #6 | General building constructions | |
| #7 | Alloys | |
| #8 | Building materials | |
| #9 | Heat-exchange device details | |
| #10 | Shaping clay |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hsieh Meng-Hsiu | 9 |
| #2 | Hsieh Meng Hsiu | 3 |
| Publication | Filing date | Title |
|---|---|---|
| US2019301155A1 | Dropped ceiling with eco-friendly ceiling panels | |
| TW201932624A | Ceramic printed circuit board and method of making the same | |
| TWI662872B | Ceramic printed circuit board and method of making the same | |
| US2019003790A1 | Ceramic heat sink and method of making the same | |
| TW201838955A | Ceramic heat sink and method of making | |
| US2017295831A1 | Rapid defrosting tray | |
| TW201107947A | Heat sink |