| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 7 | |
| #2 | United States | 4 | |
| #3 | Australia | 3 | |
| #4 | United Kingdom | 3 | |
| #5 | WIPO (World Intellectual Property Organization) | 3 | |
| #6 | Republic of Korea | 2 | |
| #7 | Canada | 1 | |
| #8 | China | 1 | |
| #9 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Basic materials chemistry | |
| #3 | Macromolecular chemistry and polymers | |
| #4 | Audio-visual technology | |
| #5 | Machine tools | |
| #6 | IT methods for management |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lawrence Frank Timothy | 6 |
| #2 | Wilson Brian | 6 |
| #3 | Belmudes Stephane | 4 |
| #4 | Hayes Patrick | 4 |
| #5 | Markiefka Patrick | 4 |
| #6 | Kasper Dirk | 4 |
| #7 | Stabel Jonas | 4 |
| #8 | Kavaney Janice | 4 |
| #9 | Duckworth David | 4 |
| #10 | Jackson Clare | 4 |
| Publication | Filing date | Title |
|---|---|---|
| GB201718627D0 | Systems and methods for selecting specialty chemicals | |
| GB201201816D0 | Oven cleaning system | |
| GB201201810D0 | Lime scale remover | |
| EP2260512A2 | Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process | |
| CN102083583A | Solder flux |