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HAESUNG DS CO LTD

Overview
  • Total Patents
    109
  • GoodIP Patent Rank
    14,480
  • Filing trend
    ⇧ 142.0%
About

HAESUNG DS CO LTD has a total of 109 patent applications. It increased the IP activity by 142.0%. Its first patent ever was published in 2010. It filed its patents most often in Republic of Korea, United States and China. Its main competitors in its focus markets semiconductors, measurement and audio-visual technology are SHINDO DENSHI KOGYO KK, DENSE PAC MICROSYSTEMS INC and LITECOOL LTD.

Patent filings in countries

World map showing HAESUNG DS CO LTDs patent filings in countries

Patent filings per year

Chart showing HAESUNG DS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Bae In Seob 29
#2 Kang Sung Il 21
#3 Won Dong Kwan 20
#4 Lee Jin Woo 19
#5 Ryu Jae Chul 11
#6 Lim Hyun Tae 9
#7 Hong Jin Kee 8
#8 Lee Byung Moon 8
#9 Kim Jong Woo 8
#10 Kim Jea Won 6

Latest patents

Publication Filing date Title
US2021107094A1 Apparatus for and method of polishing surface of substrate
KR102119142B1 Method for fabriating Wafer Level Package's Carrier using lead frame
KR20210022980A Embedded package
KR20210021805A Flexible semiconductor package and method thereof
KR20210006784A Film connecter apparatus
KR20210006210A Film connecter apparatus and chemical leak detection sensor system including thereof
KR20210004705A Smart thermometer
KR20200046484A Method of manufacturing metal mask for vapor-deposition
KR20190140337A Apparatus and manufacturing method of flexible circuit board
KR102007446B1 Sensor unit, temperature sensor including the same, method of manufacturing the sensor unit, and temperature sensor manufactured using the same
KR20190129387A Leak detection sensor using RFID tag and method of manufacturing the same
KR20190129386A Leak detection sensor using RFID tag
KR102032376B1 Sensor Package and Sensor Package Module including the same
KR20190116868A Proximity sensor
KR20190116867A Optical sensor device and Package including the same
KR101999594B1 Method for manufacturing semiconductor package substrate, semiconductor package substratemanufactured using the same, Method for manufacturing semiconductor package and semiconductor package manufactured using the same
KR20190101819A lead frame and method of manufacturing the same
KR20190047435A Leakage detection system and leakage detection method
KR20170117906A Acoustic diaphragm and method of manufacturing the same and speaker
KR20190024243A Method for manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same