EKL AG has a total of 13 patent applications. Its first patent ever was published in 1997. It filed its patents most often in Germany, Taiwan and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, computer technology and audio-visual technology are KUNSHAN VISIONOX DISPLAY CO LTD, JADE BIRD DISPLAY SHANGHAI LTD and ADVANCED MIRCO DEVICES INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Germany | 4 | |
#2 | Taiwan | 3 | |
#3 | EPO (European Patent Office) | 2 | |
#4 | WIPO (World Intellectual Property Organization) | 2 | |
#5 | Canada | 1 | |
#6 | China | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Computer technology | |
#3 | Audio-visual technology | |
#4 | Engines, pumps and turbines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Electric digital data processing | |
#3 | Casings and printed circuits | |
#4 | Non-positive-displacement pumps |
# | Name | Total Patents |
---|---|---|
#1 | Rauh-Hirschauer Alexander | 6 |
#2 | Lott Albert | 6 |
#3 | Weiss Eduard | 5 |
#4 | Sichler Frank | 5 |
#5 | Fischer Ulrich | 4 |
#6 | Fisher Ulrich | 1 |
#7 | Fischer U | 1 |
Publication | Filing date | Title |
---|---|---|
TW200608870A | Cooling element for electronic components | |
EP1747705A1 | Cover for a processor socket | |
DE102004025863A1 | Fastening module for a processor cooling unit has a film that is detachably connected at least partially between the processor and its socket, in order to indicate if a processor or socket has been damaged by incorrect handling | |
DE10331026B3 | Heat sink element for electronic component has projection of heat-conductive core of heat sink body fitting into opening in base element used for contacting electronic component | |
DE10012990A1 | Cooling device for electronic components has latent heat store for heat from electronic component that can no longer be absorbed by passive cooling element | |
DE19725074A1 | Alarm module |