DSEM HOLDINGS SDN BHD has a total of 12 patent applications. Its first patent ever was published in 2008. It filed its patents most often in United States, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, electrical machinery and energy and thermal processes are LAMINA LIGHTING INC, ATHLETE FA CORP and ATHLETE FA KK.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 5 | |
#2 | Taiwan | 3 | |
#3 | WIPO (World Intellectual Property Organization) | 2 | |
#4 | China | 1 | |
#5 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Electrical machinery and energy | |
#3 | Thermal processes | |
#4 | Machines | |
#5 | Machine tools | |
#6 | Audio-visual technology |
# | Name | Total Patents |
---|---|---|
#1 | Tan Kia Kuang | 10 |
#2 | Teoh Wah Sheng | 9 |
#3 | Ong Lay Koon | 2 |
#4 | Kuang Tan Kia | 1 |
#5 | Yoganandan Sundar | 1 |
#6 | Ong Laykoon | 1 |
#7 | Sheng Teoh Wah | 1 |
#8 | Liang Loke Chai | 1 |
#9 | Chai Chew Wui | 1 |
Publication | Filing date | Title |
---|---|---|
US2011176301A1 | Method to produce homogeneous light output by shaping the light conversion material in multichip module | |
US2011122630A1 | Solid State Lamp Having Vapor Chamber | |
US2011121326A1 | Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition | |
WO2011058436A2 | Circuit board forming diffusion bonded wall of vapor chamber | |
US2011108245A1 | Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber | |
KR20110011492A | Diffusion bonding circuit submount directly to vapor chamber | |
US2010071936A1 | Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity |