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DRESDEN MIKROELEKTRONIK

Overview
  • Total Patents
    41
About

DRESDEN MIKROELEKTRONIK has a total of 41 patent applications. Its first patent ever was published in 1987. It filed its patents most often in German Democratic Republic, Germany and Netherlands. Its main competitors in its focus markets computer technology and semiconductors are HIGGS OPL CAPITAL LLC, KILOPASS TECH INC and PROGRAMMABLE SILICON SOLUTIONS.

Patent filings in countries

World map showing DRESDEN MIKROELEKTRONIKs patent filings in countries
# Country Total Patents
#1 German Democratic Republic 39
#2 Germany 1
#3 Netherlands 1

Patent filings per year

Chart showing DRESDEN MIKROELEKTRONIKs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Raab Michael 4
#2 Weisse Stefan 3
#3 Paesch Klaus-Detlef 3
#4 Bage Frank 3
#5 Woldt Gregor 3
#6 Schubert Steffen 2
#7 Scade Andreas 2
#8 Stoehr Klaus 2
#9 Zoller Michael 2
#10 Stegemann Karl-Heinz 2

Latest patents

Publication Filing date Title
DD283016A5 Method for producing a high-performance silicide layer
DD282114A5 Method for the measurement of conductive guides with silicide or heavy metal surfaces
DD279333A1 Circuit arrangement for error recognition in reversible, parallel data vector follows
DD279320A1 Circuit arrangement for controlling and observing bus circuits for structure test
DD279351A1 Method for producing short channel transistors
DD278671A1 Method for controlling several electromagnetic consumers
DD278216A1 Method for testing memory circuits
DD278226A1 Method for protecting the internal construction of electronic components in plastum hueling before aggressive media
DD278217A1 Memory circuit with internal self-test processor
DD278001A1 Method for producing self-positioning conductive silicide layers
DD278002A1 Method for obtaining an extremely flat structured structured technological layer
DD278003A1 Method for microstructuring a technological layer
DD277770A1 Device and method for self-positioning contact elements
DD277769A1 Support for chip components
DD277768A1 Support for chip components
DD276949A1 Process for pre-treatment of silicon wafers
DD276948A1 Method for separating a dielectric layer composed of silicon nitride, in particular an endassivating layer
DD276924A1 Device for spreading detection of cylinder lenses in laser fluid sensing
DD276947A1 Method and device for in-situ-production of metal chlorides for cvd shielding
DD276185A1 Capsured semiconductor arrangement and method for producing such a semiconductor arrangement