Learn more

DOWA METALTECH CO LTD

Overview
  • Total Patents
    233
  • GoodIP Patent Rank
    11,504
  • Filing trend
    ⇩ 37.0%
About

DOWA METALTECH CO LTD has a total of 233 patent applications. It decreased the IP activity by 37.0%. Its first patent ever was published in 1995. It filed its patents most often in EPO (European Patent Office), United States and China. Its main competitors in its focus markets materials and metallurgy, electrical machinery and energy and surface technology and coating are DOWA METALTECH KK, TEKHNO TM AOZT and MELTEX INC.

Patent filings per year

Chart showing DOWA METALTECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sugawara Akira 90
#2 Narieda Hiroto 71
#3 Osanai Hideyo 42
#4 Miyazawa Hiroshi 38
#5 Sonoda Yuta 34
#6 Gao Weilin 31
#7 Kotani Hirotaka 30
#8 Aoyama Tomotsugu 29
#9 Suda Hisashi 28
#10 Shinohara Keisuke 27

Latest patents

Publication Filing date Title
WO2020262015A1 Metal-ceramic joined substrate and manufacturing method thereof
WO2021019907A1 Composite plated material and method for producing same
DE102020103983A1 Heat sink plate
WO2018105388A1 Sn plating material and production method therefor
KR20190087623A Sn plating material and manufacturing method thereof
WO2018079507A1 Copper alloy sheet and method for manufacturing same
KR20190003542A Cu-Ni-Si type copper alloy sheet material and manufacturing method
KR20160013241A Cu-Ti-based copper alloy sheet material and method of manufacturing same
WO2016121312A1 Silver-plated member and method for manufacturing same
WO2014080536A1 Metal-ceramic bonded substrate and method for producing same
HK1141563A1 Cu-ti-based copper alloy sheet material and method of manufacturing same cu-ti
EP2196548A1 Cu-Ti based copper alloy sheet material and method of manufacturing same
KR20100056635A Cu-ti-based copper alloy sheet material and method of manufacturing same
TW201018737A Cu-Ti copper alloy sheet and manufacturing method thereof
EP1967596A1 Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
EP1964937A1 Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
US2006198994A1 Ceramic circuit substrate and manufacturing method thereof
EP1518847A2 Aluminum/ceramic bonding substrate and method for producing same
EP1426464A1 Method for producing metal/ceramic bonding substrate