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MELTEX INC

Overview
  • Total Patents
    92
  • GoodIP Patent Rank
    67,640
  • Filing trend
    ⇧ 60.0%
About

MELTEX INC has a total of 92 patent applications. It increased the IP activity by 60.0%. Its first patent ever was published in 1998. It filed its patents most often in Japan, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets surface technology and coating, audio-visual technology and semiconductors are MACDERMID ENTHONE INC, REPLISAURUS TECHNOLOGIES AB and SCHMID GMBH & CO GEB.

Patent filings in countries

World map showing MELTEX INCs patent filings in countries

Patent filings per year

Chart showing MELTEX INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Emura Shigenori 18
#2 Kawashima Satoshi 12
#3 Tsukahara Yoshito 10
#4 Shigematsu Toshiyuki 10
#5 Kumagai Hiroyuki 9
#6 Fujita Koji 8
#7 Nakamura Tadayuki 8
#8 Hashimoto Naoto 8
#9 Toda Akira 8
#10 Nozaki Takashi 7

Latest patents

Publication Filing date Title
JP2020117751A Electroless Ni-Fe alloy plating solution
WO2019013160A1 Copper etching liquid
JP2019026894A Electrolytic copper plating anode and electrolytic copper plating apparatus using the same
JP2017210644A Soluble copper anode, electrolytic copper plating apparatus, electrolytic copper plating method, and storage method of acidic electrolytic copper plating liquid
US2016108254A1 Zinc immersion coating solutions, double-zincate method, method of forming a metal plating film, and semiconductor device
JP2016037642A Metal film and method for forming metal film
JP2016013953A Method for producing conductive inorganic oxide particles, and conductive inorganic oxide powder composed of conductive inorganic oxide particles obtained by the production method
JP2014196542A Copper etchant
JP2014077158A Copper plating tank
JP2014065943A Reduction type electroless tin plating bath
JP2013091846A Electroless copper plating liquid and electroless copper plating method
JP2013001993A Ultrathin copper foil with carrier foil and method of manufacturing the same
JP2012177628A Method for quantitatively analyzing sulfur compound in electroless nickel plating solution
JP2012177627A Method for measuring concentration of sulfur compound in electroless nickel plating solution
JP2012126951A Nickel plating liquid and nickel plating method
JP2011105961A Method for surface treatment of member with coating layer, and member with the method for surface treatment being executed thereon
JP2010150601A Method of treating chrome plated film
JP2010150609A Etchant and etching method
JP2009021581A Buried copper plating method for manufacturing printed circuit board and printed circuit board obtained employing the buried copper plating method
JP2009132967A Acid degreasing agent used for pretreatment of electrolytic copper plating to surface of copper or copper alloy, and electrolytic copper plating method to surface of copper or copper alloy pretreated using the acid degreasing agent