| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 | |
| #2 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Electrical machinery and energy | |
| #5 | Surface technology and coating | |
| #6 | Materials and metallurgy |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Casings and printed circuits | |
| #4 | Resistors | |
| #5 | Building materials | |
| #6 | Electrolytic coating production | |
| #7 | Coating metallic material |
| # | Name | Total Patents |
|---|---|---|
| #1 | Wei Shih-Long | 12 |
| #2 | Ho Chien-Hung | 10 |
| #3 | Hsiao Shen-Li | 9 |
| #4 | Shao Chien-Min | 2 |
| #5 | Lin Yuan-Chiang | 1 |
| #6 | Kuo Chen-Shen | 1 |
| #7 | Hsiao Sheng-Li | 1 |
| #8 | Liu Hsiao-Chun | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2016211058A1 | Method for manufacturing anticorrosive thin film resistor and structure thereof | |
| US2012064230A1 | Method for forming conductive via in a substrate | |
| US2012001212A1 | Light-Emitting Diode Packaging Structure and Substrate Therefor | |
| TW200933921A | Package carrier of light-emitting diode with high brightness |