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DOWA METALTECH KK

Overview
  • Total Patents
    247
  • GoodIP Patent Rank
    12,359
  • Filing trend
    ⇩ 14.0%
About

DOWA METALTECH KK has a total of 247 patent applications. It decreased the IP activity by 14.0%. Its first patent ever was published in 2005. It filed its patents most often in Japan. Its main competitors in its focus markets materials and metallurgy, electrical machinery and energy and surface technology and coating are DOWA METALTECH CO LTD, MAYER STEVEN T and AKSU SERDAR.

Patent filings in countries

World map showing DOWA METALTECH KKs patent filings in countries
# Country Total Patents
#1 Japan 247

Patent filings per year

Chart showing DOWA METALTECH KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Narueda Hiroto 57
#2 Sugawara Akira 55
#3 Osanai Hideyo 34
#4 Miyazawa Hiroshi 33
#5 Suda Hisashi 31
#6 Ko Irin 29
#7 Shinohara Keisuke 27
#8 Aoyama Tomotane 21
#9 Sasaki Fumiaki 18
#10 Ogata Masafumi 18

Latest patents

Publication Filing date Title
JP2021008670A Composite plated material, and method of producing the same
JP2021003885A Bonded body of metal plates, and manufacturing method thereof
JP2021009996A Metal-ceramic bonding substrate and manufacturing method thereof
JP2020122219A Copper alloy sheet material and manufacturing method therefor
JP2020176281A Copper alloy sheet material and method for manufacturing the same
JP2020164909A Plated material and manufacturing method of the same
JP2020161707A Method for manufacturing metal ceramic bonding substrate
JP2020152929A Composite plated material, and method of producing the same
JP2020143307A Silver plated material, and method of producing the same
JP2020136581A Metal-ceramic bonded substrate and manufacturing method thereof
JP2020132477A Metal-ceramic joint substrate and its manufacturing method
JP2020117747A Composite plated material, and method of producing the same
JP2020105546A Copper alloy sheet material, and method for manufacturing the same
JP2020076142A Copper alloy sheet material and method for manufacturing the same
JP2019044274A Silver plated material and method for producing the same
JP2020079436A HIGH YOUNG Cu-Ni-Al-BASED COPPER ALLOY SHEET, METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE SPRING MEMBER
JP2020050548A Metal-ceramic bonded substrate, and method of producing the same
JP2020050923A Cu-Ni-Al-BASED COPPER ALLOY SHEET MATERIAL, MANUFACTURING METHOD THEREFOR, AND CONDUCTIVE SPRING MEMBER
JP2020050911A Plating apparatus and plating method using the same
JP2019044262A Partial plating method