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DING HANYI

Overview
  • Total Patents
    38
About

DING HANYI has a total of 38 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, telecommunications and machines are ENDWAVE CORP, CHANG EDWARD YI and UNITED MONOLITHIC SEMICONDUCT.

Patent filings in countries

World map showing DING HANYIs patent filings in countries
# Country Total Patents
#1 United States 38

Patent filings per year

Chart showing DING HANYIs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ding Hanyi 38
#2 He Zhong-Xiang 12
#3 Feng Kai D 12
#4 Woods Jr Wayne H 11
#5 Liu Xuefeng 9
#6 Wang Guoan 6
#7 Stamper Anthony K 5
#8 Wang Ping-Chuan 5
#9 Jin Zhenrong 5
#10 Joseph Alvin J 3

Latest patents

Publication Filing date Title
US2014062519A1 High-frequency cobra probe
US2013200521A1 Inductors and wiring structures fabricated with limited wiring material
US2013193584A1 On-chip radial cavity power divider/combiner
US2013168783A1 Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structures
US2013127564A1 Reconfigurable Wilkinson power divider and design structure thereof
US2013044838A1 Load tolerant voltage controlled oscillator (VCO), IC and CMOS IC including the VCO
US2012326798A1 On-chip transmission line structures with balanced phase delay
US2012104546A1 Structure and design structure for high-Q value inductor and method of manufacturing the same
US2012102444A1 On-chip tunable transmission lines, methods of manufacture and design structures
US2012025881A1 High frequency quadrature PLL circuit and method
US2011254168A1 Integrated circuit interconnect structure
US2011073858A1 Test structure for determination of TSV depth
US2011049676A1 Method, structure, and design structure for a through-silicon-via Wilkinson power divider
US2011043299A1 Compact on-chip branchline coupler using slow wave transmission line
US2010276809A1 T-connections, methodology for designing T-connections, and compact modeling of T-connections
US2010265011A1 Circuit structure and design structure for an optionally switchable on-chip slow wave transmission line band-stop filter and a method of manufacture
US2010231322A1 On-chip millimeter wave lange coupler
US2010032810A1 Through wafer vias and method of making same
US2010032761A1 Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrate
US2010033395A1 Integrated millimeter wave antenna and transceiver on a substrate