CUFER ASSET LTD LLC has a total of 71 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2002. It filed its patents most often in United States, Republic of Korea and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, optics and surface technology and coating are CUBIC WAFER INC, TREZZA JOHN and ZHONGZHENG BOXIN CHONGQING SEMICONDUCTOR CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 21 | |
#2 | Republic of Korea | 14 | |
#3 | EPO (European Patent Office) | 13 | |
#4 | China | 11 | |
#5 | WIPO (World Intellectual Property Organization) | 8 | |
#6 | Japan | 4 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Optics | |
#3 | Surface technology and coating | |
#4 | Machines | |
#5 | Digital networks | |
#6 | Computer technology | |
#7 | Machine tools | |
#8 | Basic communication technologies |
# | Name | Total Patents |
---|---|---|
#1 | Trezza John | 53 |
#2 | John Trezza | 9 |
#3 | Callahan John | 7 |
#4 | Dudoff Gregory | 5 |
#5 | Kelly James | 4 |
#6 | Brown Wendell | 4 |
#7 | Milener Scott | 4 |
#8 | Dugas Roger | 3 |
#9 | Gregory Dudov | 3 |
#10 | John Colahan | 3 |
Publication | Filing date | Title |
---|---|---|
USRE48313E | Physical digital media delivery | |
US2016173523A1 | Enhanced browsing with security scanning | |
CN103050420A | Constraint to components with high migration rate in electric connection | |
WO2008101095A2 | Variable off-chip drive | |
EP2111635A1 | Post-seed deposition process | |
WO2008085771A2 | Improved sensitivity capacitive sensor | |
CN101663742A | Front-end processed wafer having through-chip connections | |
US2008258284A1 | Ultra-thin chip packaging | |
CN101796636A | Chip connection method | |
US2006278993A1 | Chip connector |