CUBIC WAFER INC has a total of 47 patent applications. Its first patent ever was published in 2002. It filed its patents most often in WIPO (World Intellectual Property Organization), Republic of Korea and China. Its main competitors in its focus markets semiconductors, optics and machines are TREZZA JOHN, ZHONGZHENG BOXIN CHONGQING SEMICONDUCTOR CO LTD and Suzhou hanhua semiconductor co ltd.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 19 | |
#2 | Republic of Korea | 11 | |
#3 | China | 9 | |
#4 | United States | 6 | |
#5 | Canada | 1 | |
#6 | EPO (European Patent Office) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Optics | |
#3 | Machines | |
#4 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Trezza John | 36 |
#2 | Dudoff Gregory | 8 |
#3 | Callahan John | 6 |
#4 | John Trezza | 6 |
#5 | Dudoff Greg | 3 |
#6 | Misra Abhay | 3 |
#7 | Diagne Mohamed | 3 |
#8 | Callahan Jon | 3 |
#9 | Roger Dugas | 2 |
#10 | Kang Keith | 1 |
Publication | Filing date | Title |
---|---|---|
WO2008048925A2 | Wafer via formation | |
US2007281460A1 | Front-end processed wafer having through-chip connections | |
WO2006138492A2 | Post & penetration interconnection | |
WO2006138490A2 | Routingless chip architecture | |
KR20080019622A | Chip connector | |
WO2006138493A2 | Chip tooling | |
WO2006138424A2 | Through chip connection | |
US2006278989A1 | Triaxial through-chip connection | |
US7289547B2 | Laser and detector device | |
US7077577B2 | Multi-piece fiber optic component and manufacturing technique |