BERGMANN MICHAEL JOHN has a total of 13 patent applications. Its first patent ever was published in 2002. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and optics are UNITED EPITAXY CO LTD, ZHONGZHENG BOXIN CHONGQING SEMICONDUCTOR CO LTD and TREZZA JOHN.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 8 | |
#2 | WIPO (World Intellectual Property Organization) | 5 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Micro-structure and nano-technology | |
#3 | Optics | |
#4 | Surface technology and coating | |
#5 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Bergmann Michael John | 13 |
#2 | Emerson David Todd | 6 |
#3 | Donofrio Matthew | 4 |
#4 | Schneider Kevin Shawne | 3 |
#5 | Haberern Kevin | 3 |
#6 | Kong Hua-Shuang | 2 |
#7 | Haberern Kevin Ward | 2 |
#8 | Edmond John Adam | 2 |
#9 | Doverspike Kathleen Marie | 2 |
#10 | Williams Christopher D | 2 |
Publication | Filing date | Title |
---|---|---|
US2013264589A1 | Wafer level packaging of light emitting diodes (LEDs) | |
US2012211793A1 | Low temperature high strength metal stack for die attachment | |
US2012187431A1 | Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature | |
US2011187294A1 | Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses | |
US2011031502A1 | Light emitting diodes including integrated backside reflector and die attach | |
US2008121910A1 | Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same |