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COMCHIP TECHNOLOGY CO LTD

Overview
  • Total Patents
    25
  • GoodIP Patent Rank
    181,390
About

COMCHIP TECHNOLOGY CO LTD has a total of 25 patent applications. Its first patent ever was published in 2001. It filed its patents most often in Taiwan and United States. Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are THIN FILM MODULE INC, GLOBAL ADVANCED PACKAGING TECH and OHKUCHI MAT CO LTD.

Patent filings in countries

World map showing COMCHIP TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 21
#2 United States 4

Patent filings per year

Chart showing COMCHIP TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chen Wen-Long 13
#2 Hu Chih-Liang 10
#3 Chen Pan-Nan 6
#4 Lin Hung-Wen 5
#5 Lai Chien-Chih 5
#6 Yang Cheng-Chieh 4
#7 Liang Ming-Chong 4
#8 Yu Cheen-Hai 2
#9 Lin Hungwen 2
#10 Yu Chen-Hai 2

Latest patents

Publication Filing date Title
TWI704668B Method for manufacturing die package
TWI689997B Method for manufacturing chip package
TWI687986B Method for manufacturing chip package
TWI670779B Method for manufacturing chip package
TWI668771B Method for manufacturing chip package
TWI683415B Method for manufacturing chip package
TW201614744A Integrated circuit package and method for manufacturing the same
TW200847301A Process for making leadless package for discrete circuit components
TW200847360A Leadless package for discrete circuit components
TWI244744B Flat package for circuit components having soldered metallic contact terminal blocks with lateral surface and process of fabricating the same
TW200611353A Flat package for circuit components having metallic contact terminal blocks with lateral surface and process of fabricating the same
TW200516750A Flat package for circuit components having metallic contact terminal blocks and process of fabricating the same
TWI223580B Circuit component having fabrication-stage blind holes and process of making
TW200507199A Leadless flat package for circuit components
TW573450B Process for fabricating a discrete circuit component on a substrate having fabrication stage clogged through-holes
TW200419755A Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls
US6870261B2 Discrete circuit component having an up-right circuit die with lateral electrical connections
TW583763B Discrete circuit component having an up-right circuit die with lateral electrical connections
TW573342B The manufacture method for the later gradation punch of the dispersed circuit component
TW556261B Buried discrete circuit components and fabricating method thereof