CARDXX INC has a total of 42 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Australia, Canada and EPO (European Patent Office). Its main competitors in its focus markets machines, computer technology and semiconductors are FICO BV, NAKAMURA YOSHINOBU and TAKAHASHI KIYOSHI.
# | Country | Total Patents | |
---|---|---|---|
#1 | Australia | 6 | |
#2 | Canada | 5 | |
#3 | EPO (European Patent Office) | 5 | |
#4 | Israel | 5 | |
#5 | United States | 5 | |
#6 | Indonesia | 3 | |
#7 | Brazil | 2 | |
#8 | China | 2 | |
#9 | Republic of Korea | 2 | |
#10 | Mexico | 2 | |
#11 | WIPO (World Intellectual Property Organization) | 2 | |
#12 | Hong Kong | 1 | |
#13 | Norway | 1 | |
#14 | New Zealand | 1 |
# | Industry | |
---|---|---|
#1 | Machines | |
#2 | Computer technology | |
#3 | Semiconductors | |
#4 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Shaping of plastics | |
#2 | Data recognition and presentation | |
#3 | Unspecified technologies | |
#4 | Semiconductor devices | |
#5 | Casings and printed circuits | |
#6 | Fillers |
# | Name | Total Patents |
---|---|---|
#1 | Reed Paul | 15 |
#2 | Tiffany Harry J Iii | 12 |
#3 | Tiffany Harry J | 4 |
#4 | Tiffany Iii Harry J | 4 |
#5 | Tiffany H J Iii | 2 |
Publication | Filing date | Title |
---|---|---|
AU2005329469A1 | Method for making Advanced Smart Cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces | |
US2006162156A1 | Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces | |
AU1834501A | Method for making smart cards | |
US6241153B1 | Method for making tamper-preventing, contact-type, smart cards | |
US6256873B1 | Method for making smart cards using isotropic thermoset adhesive materials | |
US6025054A | Smart cards having glue-positioned electronic components | |
AU6892198A | Method of making smart cards |